| Nomor bagian : | 216-6278-00-3303 |
|---|---|
| Pabrikan / Merek : | 3M |
| Deskripsi : | CONN IC DIP SOCKET ZIF 16POS GLD |
| Status RoHs : | Memimpin bebas / RoHS Compliant |
| Jumlah yang tersedia | 4126 pcs |
| Lembar data | 216-6278-00-3303.pdf |
| Mengetik | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Penghentian Panjang Posting | 0.110" (2.78mm) |
| Penghentian | Solder |
| Seri | OEM |
| Pitch - Pos | 0.100" (2.54mm) |
| Pitch - Kawin | 0.100" (2.54mm) |
| Pengemasan | Bulk |
| Nama lain | 2-001604840000033003 2.16628E+12 2001604840-000033003 216-4840-00-3303 2166278003303 3M1603 51138-76511-8 5113876511 51138765118 5400733859 54007338598 7010304839 80-6101-2435-8 80610124358 JE-1500-9273-0 JE150092730 |
| Suhu Operasional | -55°C ~ 105°C |
| Jumlah Posisi atau Pins (Grid) | 16 (2 x 8) |
| mount Jenis | Through Hole |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Bahan mudah terbakar Penilaian | UL94 V-0 |
| Manufacturer Standard Lead Time | 8 Weeks |
| Status Gratis Memimpin / Status RoHS | Lead free / RoHS Compliant |
| Material perumahan | Polyether Imide (PEI), Glass Filled |
| fitur | Closed Frame |
| Peringkat saat ini | 1A |
| Hubungi Resistance | - |
| Bahan Kontak - Pos | Beryllium Copper |
| Bahan Kontak - Kawin | Beryllium Copper |
| Hubungi Finish Tebal - Pos | 250.0µin (6.35µm) |
| Hubungi Finish Thickness - Mating | 250.0µin (6.35µm) |
| Hubungi Selesai - Pos | Gold |
| Hubungi Finish - Mating | Gold |
3M
